Moving apparatus, exposure apparatus, and device manufacturing method

ABSTRACT

A moving apparatus includes a first actuator having a movable element and a stator, and a second actuator for driving the stator. The second actuator drives the stator in a direction to suppress rotation of the stator which accompanies movement of the movable element.

FIELD OF THE INVENTION

The present invention relates to a moving apparatus, an exposureapparatus, and a device manufacturing method.

BACKGROUND OF THE INVENTION

In recent years, demand has arisen for higher-accuracy control for amoving apparatus which moves with an object such as a structure placedon its stage. For example, with an exposure apparatus used for themanufacture of semiconductor devices or the like, as the integrationdensity of the semiconductor devices increases, a higher-accuracymicropatterning technique is demanded. In order to realize this, amoving apparatus such as a wafer stage must be controlled at highaccuracy.

Typical examples of an exposure apparatus used for the manufacture ofsemiconductor devices include a step-and-repeat exposure apparatus (tobe referred to as a “stepper” hereinafter) and a step-and-scan exposureapparatus (to be referred to as a “scanner” hereinafter).

A stepper is an exposure apparatus that sequentially exposes the patternof a master (e.g., a reticle, mask, or the like) onto a plurality ofexposure regions on a substrate (e.g., a wafer, glass substrate, or thelike), used for manufacturing semiconductor devices, through aprojection optical system while stepping the substrate.

A scanner is an exposure apparatus that repeats exposure and transferonto the plurality of regions on the substrate by repeating stepping andscanning exposure. The scanner limits exposure light with a slit, sothat it uses that portion of a projection optical system which isrelatively close to the optical axis. For this reason, generally, thescanner can expose a fine pattern with a wider angle of view at higheraccuracy than with the stepper.

Such an exposure apparatus has a stage (e.g., a wafer stage, reticlestage, or the like) for moving a wafer or reticle at a high speed. Whenthe stage is driven, a reaction force of an inertial force accompanyingacceleration and deceleration of the stage occurs. When the reactionforce is transmitted to the stage surface plate, the stage surface plateswings or vibrates. Consequently, characteristic vibration is excited inthe mechanical system of the exposure apparatus to generatehigh-frequency vibration. This vibration interferes with high-accuracycontrol for the moving apparatus.

To decrease the vibration of the apparatus caused by the reaction force,a moving apparatus as shown in FIG. 6 is proposed. As shown in FIG. 6, aconventional moving apparatus has a stage 51 and a movable body (to bereferred to as a “counter” hereinafter) 52 for canceling the reactionforce. The stage 51 and counter 52 are driven by feedback controlcontrolling a position in the Y direction, and a target value is givensuch that the ratio of the moving distance of the stage 51 in the Ydirection to that of the counter 52 in the Y direction is substantiallyconstant. This improves the canceling efficiency for the reaction forceof the stage 51.

With the conventional moving apparatus, however, as shown in FIG. 6, itis difficult to overlay the power point in the X direction of the stage51 and the barycenter in the X direction of the counter 52 completely.Hence, due to the displacement in the X direction of the power point ofthe stage 51 and the barycenter of the counter 52, when the stage 51moves in the Y direction, a moment is produced in the counter 52, andthe counter 52 rotates. Therefore, with the conventional movingapparatus, it is difficult to control positioning of the stage at highaccuracy.

SUMMARY OF THE INVENTION

The present invention has been made in view of the above problem, andhas as its object to control, e.g., positioning of a stage at highaccuracy.

The first aspect of the present invention relates to a moving apparatus,characterized by comprising a first actuator having a movable elementand a stator, a second actuator which drives the stator, wherein thesecond actuator drives the stator in a direction to suppress rotation ofthe stator which accompanies movement of the movable element. The secondactuator comprises an actuator which drives the stator in the Ydirection and an actuator which drives the stator in the X and θdirection.

A preferred embodiment of the present invention preferably comprises afeed forward compensator which controls the second actuator on the basisof a signal supplied to the first actuator or a physical quantity of themovable element.

A preferred embodiment of the present invention further preferablycomprises a compensator which controls the second actuator on the basisof an acceleration of the movable element.

According to a preferred embodiment of the present invention, a targetacceleration is preferably used as the acceleration of the movableelement.

According to a preferred embodiment of the present invention, an actualacceleration measured by a measurement unit is preferably used as theacceleration of the movable element.

According to a preferred embodiment of the present invention, the signalpreferably includes a manipulated variable with which the first actuatoris operated.

According to a preferred embodiment of the present invention, a gain ofthe compensator is preferably determined in accordance with a distancebetween a power point of the movable element in a predetermineddirection and a barycenter of the stator when the movable element isdriven by the first actuator.

According to a preferred embodiment of the present invention, the statorpreferably absorbs a reaction force that acts on the stator when themovable element is driven by the first actuator.

A second aspect of the present invention relates to an exposureapparatus, characterized by comprising an optical system which projectsexposure light, to be irradiated to a master having a pattern, onto asubstrate, a stage which can move while holding the substrate or themaster, a first actuator having a movable element and a stator, themovable element being connected to the stage, a second actuator whichdrives the stator in the Y direction, and a third actuator which drivesthe stator in the X and θ direction, wherein the third actuator drivesthe stator in a direction to suppress rotation of the stator whichaccompanies movement of the movable element.

A third aspect of the present invention relates to a semiconductordevice manufacturing method, characterized by comprising an applyingstep of applying a photosensitive material on a substrate, an exposurestep of transferring a pattern onto the substrate, applied with thephotosensitive material in the applying step, by utilizing the aboveexposure apparatus, and a developing step of developing thephotosensitive material on the substrate where the pattern has beentransferred in the exposure step.

Other features and advantages of the present invention will be apparentfrom the following description taken in conjunction with theaccompanying drawings, in which like reference characters designate thesame or similar parts throughout the figures thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of the specification, illustrate embodiments of the invention and,together with the description, serve to explain the principles of theinvention.

FIGS. 1A and 1B are views showing a moving apparatus according to thefirst embodiment of the present invention;

FIG. 2 is a view showing in detail the moving apparatus according to thefirst embodiment of the present invention;

FIG. 3 is a control block diagram according to the first embodiment ofthe present invention;

FIG. 4 is a control block diagram according to the second embodiment ofthe present invention;

FIG. 5 is a control block diagram according to the third embodiment ofthe present invention;

FIG. 6 is a view showing a conventional moving apparatus;

FIG. 7 is a conceptual view of an exposure apparatus to which a movingapparatus according to a preferred embodiment of the present inventionis applied;

FIG. 8 is a flow chart showing the flow of an overall semiconductordevice manufacturing process; and

FIG. 9 is a flow chart showing the detailed flow of the wafer process.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The preferred embodiments of the present invention will be described indetail with reference to the accompanying drawings. The same constituentelements in the drawings are denoted by the same reference numerals.

(First Embodiment)

A moving apparatus as the first preferred embodiment of the presentinvention will be described with reference to the drawings.

FIG. 1A is a plan view showing the arrangement of the moving apparatusaccording to a preferred embodiment of the present invention, and FIG.1B is a sectional view of the same. As shown in FIG. 1B, a flat guidesurface 6 as the reference surface of the moving apparatus is formed ona reference structure 4. A movable portion 3 is supported above the flatguide surface 6 in a non-contact manner by static pressure bearings 7.As shown in FIG. 1A, the movable portion 3 can move in the Y directionalong the flat guide surface 6. Electromagnetic actuators 8 and 8′ formoving the movable portion 3 in the Y direction are provided on the twosides of the movable portion 3, as shown in FIG. 1B. The movable portion3 is driven by the two sets of electromagnetic actuators 8 and 8′. Theelectromagnetic actuators 8 and 8′ include movable elements 2 and 2′connected to the movable portion 3 which moves along the flat guidesurface 6, and stators 1 and 1′. For example, a top plate 5 is formed onthe movable portion 3. A moving target object (e.g., a wafer or thelike) can be placed on the top plate 5.

The stators 1 and 1′ are supported above the flat guide surface 6 in anon-contact manner by static pressure bearings 9, and can move in the Ydirection. The stators 1 and 1′ have predetermined masses, and canabsorb a reaction force generated by acceleration and deceleration ofthe movable portion 3. The stators 1 and 1′ can be formed of permanentmagnets, and the movable elements 2 and 2′ can be formed of coils.Conversely, the stators 1 and 1′ may be formed of coils, and the movableelements 2 and 2′ may be formed of permanent magnets.

One or a plurality of interferometers (not shown) is provided to controlthe moving apparatus, and can position the movable elements 2 and 2′ ormovable portion 3 with reference to the reference structure 4.Similarly, an interferometer (not shown) for measuring the positions ofthe stators 1 and 1′ is provided to position the stators 1 and 1′ whichmove within a plane. In the above manner, a movable body 300 serving asa stage having the movable portion 3 (including the top plate 5 providedon it) and the movable elements 2 and 2′ can move in the Y direction ina non-contact manner with the flat guide surface 6.

When the movable body 300 moves, the stators 1 and 1′ receive thereaction force of a force acting on the movable body 300. Upon receptionof the reaction force, the stators 1 and 1′ can move along the flatguide surface 6. More specifically, the stators 1 and 1′ serve to absorbthe reaction force accompanying the driving operation of the movablebody 300 by moving along the flat guide surface 6. For example, when themovable body 300 including the movable portion 3 and the like is drivenin the +Y direction, the stators 1 and 1′ receive the reaction force inthe −Y direction and move in the −Y direction, so that they can absorbthe reaction force.

As described above, the reaction force during acceleration anddeceleration which acts on the movable body 300 when it moves can beabsorbed by the stators 1 and 1′. The reaction force is converted intokinetic energy when the stators 1 and 1′ (reaction force movableportion), which have received the reaction force, move. Although twostators are provided in this case, the present invention is not limitedto this. The number of stators may be one, or three or more.

With the above arrangement, the force acting on the movable body 300 andits reaction force are limited on the flat guide surface 6 of thereference structure 4. Hence, the reference structure 4 can be preventedfrom vibrating due to the driving force acting on the movable body 300and the reaction force acting on the stators 1 and 1′. Furthermore,according to this embodiment, vibration can be prevented fromtransmitting to the floor of the area where the moving apparatus isinstalled, or to other apparatuses.

When the masses of the stators 1 and 1′ are increased to be sufficientlylarger than the mass of the movable body 300 including the movableportion 3, and the like, the movable range of the stators 1 and 1′ canbe limited to be small. This enables downsizing of the apparatus, andreduces the floor area of the semiconductor factory, thus contributingto the reduction of the construction cost of the entire semiconductorfactory.

A more practical arrangement of the moving apparatus according to thefirst preferred embodiment of the present invention will be described.FIG. 2 shows the more practical arrangement of the moving apparatusaccording to the preferred embodiment of the present invention. As shownin FIG. 2, the flat guide surface 6 as the reference surface of themoving apparatus is formed on the reference structure 4. The movableportion 3 (see FIG. 1B) provided under the top plate (X-Y stage) 5 issupported on the flat guide surface 6 in a non-contact manner throughthe static pressure bearings 7, and can move in an X-Y direction. Theelectromagnetic actuators 8 (not shown) and 8′ for driving the movableportion 3 with a long stroke in the Y direction and with a short strokein the X direction are provided on the two sides of the movable portion3. The electromagnetic actuators 8 and 8′ include the movable elements 2and 2′ and stators 1 and 1′ which are separate from and independent ofeach other on the right and left sides (see FIGS. 1A and 1B). Two, rightand left movable-portion Y magnets 10 and two, right and leftmovable-portion X magnets 11 are attached to the right and left movableelements 2 and 2′. The stators 1 and 1′ are supported on the flat guidesurface 6 in a non-contact manner through the static pressure bearings 8(see FIG. 1B), and can move in the X-Y direction (planar directions).The stators 1 and 1′ have predetermined masses, and can absorb thereaction force, generated by acceleration and deceleration of themovable body 300 including the movable portion 3 and movable elements 2and 2′, by moving on the flat guide surface 6. X-axis linear motorsingle-phase coils 12 and Y-axis linear motor multiphase coils 13 havingan array of a plurality of coils in the Y direction are arranged in thestators 1 and 1′, and are switched to achieve movement in the X and Yaxes.

The position of the top plate (X-Y stage) 5 is measured by a laserinterferometer formed of a laser head 16, a Y-axis measurement mirror17, an X-axis measurement bar mirror 18, left and right two Y-axismeasurement detectors 19, front and rear two X-axis measurementdetectors 20, and the like. More specifically, optical elements 22 and22′ loaded on the top plate 5 are irradiated with laser beams in the Ydirection. The measurement beams are reflected or polarized in theX-axis direction to irradiate the X-axis measurement bar mirror 18, andare measured by the X-axis measurement detector 20, so that the positionin the X-axis direction of the top plate 5 is measured. The position inthe Y-axis direction of the top plate 5 is measured in the followingmanner. The Y-axis measurement mirror 17 is irradiated with a laser beamin the Y direction, and the laser beam is measured by the Y-axismeasurement detector 19. The positions in the Y-axis direction of thestators 1 and 1′ are measured by two, right and left stator Y-axismeasurement detectors 21.

The movable portion 3 in which the substrate (wafer) is placed on thetop plate (X-Y stage) 5 is moved in the X-Y direction by theelectromagnetic actuators 8 and 8′ constituted by the movable elements 2and 2′ and stators 1 and 1′. The stators 1 and 1′ receive the reactionforce of the force acting on the movable body 300 including the movableportion 3 and movable elements 2 and 2′. The stators 1 and 1′ move onthe flat guide surface 6 by the reaction force. The stators 1 and 1′ canabsorb the reaction force by moving on the flat guide surface 6. In thisembodiment, when the movable body 300 including the movable portion 3moves in the +Y direction, the stators 1 and 1′ receive the reactionforce in the −Y direction and move in the −Y direction.

Furthermore, according to this embodiment, as the actuators for drivingthe stators 1 and 1′ in the Y-axis direction, two, right and left Y-axisposition control linear motors 14 and 14′ are provided to the referencestructure 4. Similarly, four, left, right, front, and rear X-axisposition control linear motors 15 and 15′ for driving the stators 1 and1′ in the X-axis direction are provided to the reference structure 4.

A total of four, front and rear X-direction position measurement units(not shown) are provided, two on the left side of the support line ofthe X-axis position control linear motor 15 and two on the right side ofthe support line of the X-axis position control linear motor 15′, sothat the positions in the X direction of the stators 1 and 1′ can bemeasured.

A process of the moving apparatus according to the first preferredembodiment of the present invention will be described.

FIG. 3 is a control block diagram of the moving apparatus according tothe first preferred embodiment of the present invention. A feedbackcontrol system A is a feedback control system for the movable elements 2and 2′, and a feedback control system B is a feedback control system forthe stators 1 and 1′. The target value R1 of the feedback control systemA is fed forward to the feedback control system B via a derivativeelement (K*s*s).

As shown in FIG. 1B, a case will be described wherein the movableportion 3 having the top plate 5 is to be driven in the Y direction bythe electromagnetic actuators 8 and 8′ having the movable elements 2 and2′ connected to the movable portion 3 and stators 1 and 1′. The movableportion 3 is positioned when the electromagnetic actuators 8 and 8′including the movable elements 2 and 2′ and stators 1 and 1′ arefeedback-controlled on the basis of the position information of themovable portion 3 measured by the Y-axis measurement detectors 19.Reference numeral P1(s) denotes the dynamic characteristics of theelectromagnetic actuators 8 and 8′ including the movable elements 2 and2′ and stators 1 and 1′. An output from P1(s) indicates the measurementposition, i.e., a position Y1 of the movable portion 3 measured by theY-axis measurement detectors 19. A compensator C1(s) provides amanipulated variable to P1(s), i.e., the electromagnetic actuators 8 and8′ on the basis of the deviation between target value R1 and controlledvariable Y1.

As described above, the movable portion 3 can be driven to apredetermined position by causing the controlled variable (positioncontrolled variable) Y1 of the movable portion 3 to follow a targetvalue (position target value) R1 with the feedback control system A ofthe movable portion 3.

The moving apparatus according to the first preferred embodiment of thepresent invention has the feedback control system B for controlling therotation amount on the X-Y plane of the stators 1 and 1′, so that thestators 1 and 1′ are kept horizontal to the movable direction (Ydirection) of the movable portion 3. Referring to FIG. 3, referencenumeral P2(s) denotes the dynamic characteristics of electromagneticactuators having the linear motors 15 and 15′ and right and left stators1 and 1′ for driving the stators 1 and 1′. An output from P2(s)indicates the measurement position, i.e., a rotation amount θ1 of thestator elements 1 and 1′. The rotation amount θ1 is calculated by thetwo X-direction position measurement units (not shown) attached to eachof the stators 1 and 1′. A compensator C2(s) is arranged as an inputstage with respect to the stators 1 and 1′ serving as the controltarget. A compensator C2(s) provides a manipulated variable to P2(s),i.e., the electromagnetic actuators for driving the stators 1 and 1′ onthe basis of the deviation between target value 0 and the rotationamount θ1.

With the above arrangement, in the feedback control system B for thestators 1 and 1′, the target value is set to 0, so that the rotationamount of the stators 1 and 1′ can be kept at 0.

According to this embodiment, as shown in FIG. 3, the derivative element(K*s*s) differentiates the target value R1 for controlling the movableelements 2 and 2′ and feeds forward the target acceleration calculatedfrom the target value to the feedback control system B which controlsthe rotation amount of the stators 1 and 1′. Reference symbol K denotesthe feed forward gain of a signal to be supplied to the electromagneticactuators of the feedback control system B. According to thisembodiment, a manipulated variable to P2(s), i.e., the electromagneticactuators for driving the stators 1 and 1′ is generated by combining thetarget acceleration calculated by the derivative element (K*s*s) and theoutput from the compensator C2(s). Hence, in the feedback control systemB, the electromagnetic actuators for driving the stators 1 and 1′ can becontrolled to suppress the rotation of the stators 1 and 1′ by applyingthe target acceleration calculated by the derivative element (K*s*s) tothe manipulated variable in advance. The stators 1 and 1′ can be drivenin the direction to suppress their rotation that accompanies themovement of the movable elements 2 and 2′. As a result, rotation of thestators 1 and 1′, which occurs when accelerating the movable elements 2and 2′ and movable portion 3, is suppressed, so that the stage can bepositioned at high accuracy.

(Second Embodiment)

FIG. 4 is a control block diagram of a moving apparatus according to thesecond preferred embodiment of the present invention. In thisembodiment, the output from the compensator C1(s) is fed forward to thefeedback control system B via a proportional element(K). As shown inFIG. 4, a manipulated variable for manipulating the electromagneticactuators 8 and 8′ of a feedback control system A is increased by afactor of N and is fed forward to a feedback control system B whichcontrols the rotation amount of stators 1 and 1′. Similarly to the firstembodiment, reference symbol K denotes the feed forward gain of a signalto be supplied to the electromagnetic actuators of the feedback controlsystem B. According to this embodiment, a manipulated variable to P2(s),i.e., the electromagnetic actuators for driving the stators 1 and 1′ isgenerated by combining the output from the compensator C1(s) beingincreased by a proportional element(K) by a factor of N and the outputfrom the compensator C2(s). Hence, in the feedback control system B, theelectromagnetic actuators for driving the stators 1 and 1′ can becontrolled to suppress the rotation of the stators 1 and 1′ by applyingthe output from the compensator C1(s) being increased by a proportionalelement(K) by a factor of N to the manipulated variable in advance.

(Third Embodiment)

FIG. 5 is a block diagram of a moving apparatus according to the thirdpreferred embodiment of the present invention. In this embodiment, thecontrolled value (position information) of the feedback control system Ais fed forward to the feedback control system B via a derivative element(K*s*s). As shown in FIG. 5, the derivative element (K*s*s)differentiates the position information Y1 of movable elements 2 and 2′measured by Y-axis measurement detectors 19, a feedback control system Afeeds forward the acceleration (actual acceleration) of the movableelements 2 and 2′ calculated from the position information to a feedbackcontrol system B which controls the rotation amount of stators 1 and 1′.In the same manner as in the first and second embodiments, referencesymbol K denotes the feed forward gain of a signal to be supplied to theelectromagnetic actuators of the feedback control system B. According tothis embodiment, a manipulated variable to P2(s), i.e., theelectromagnetic actuators for driving the stators 1 and 1′ is generatedby combining the actual acceleration calculated by the derivativeelement (K*s*s) and the output from the compensator C2(s). Hence, in thefeedback control system B, the electromagnetic actuators for driving thestators 1 and 1′ can be controlled to suppress the rotation of thestators 1 and 1′ by applying the target acceleration calculated by thederivative element (K*s*s) to the manipulated variable in advance. Anacceleration meter may be provided in place of the Y-axis measurementdetectors 19.

(Other Embodiment)

A moving apparatus according to a preferred embodiment of the presentinvention is formed such that its movable portion 3 is movable in the Xdirection and the power point in the X direction of the movable portion3 with respect to counter masses (stators) 1 and 1′ changes inaccordance with the position in the X direction of the movable portion3. In this case, the moving apparatus can be formed such that the gain(feed forward gain) of a signal to be supplied to the electromagneticactuators of a feedback control system B changes in accordance with thedistance between the power points of movable elements 2 and 2′ duringdriving in the X direction and the barycenters of the stators 1 and 1′.This enables higher-accuracy positioning control.

As described above, according to the preferred embodiment of the presentinvention, when the signal used in the control system for the movableportion is fed forward to a control system for the stators, swing,rotation, and the like, of the stators which occur due to accelerationof the movable elements, can be suppressed.

FIG. 7 is a conceptual view of an exposure apparatus which is used whenthe moving apparatus according to any preferred embodiment of thepresent invention is applied to a semiconductor device manufacturingprocess. Referring to FIG. 7, a reticle 72 serving as a master isirradiated with light emerging from an illumination optical system 71.The reticle 72 is held on a reticle stage 73, and its pattern is reducedand projected with the magnification of a reduction projection lens 74to form a reticle pattern image on the image surface of the reductionprojection lens 74. The image surface of the reduction projection lens74 is perpendicular to the Z direction. A resist is applied to thesurface of a substrate 75 as an exposure target sample, and shots formedin an exposure process are arrayed on the resist. The substrate 75 isplaced on a stage 300 including a movable body and the like. The stage300 is formed of a chuck for fixing the substrate 75, an X-Y stagehorizontally movable in X- and Y-axis directions, and the like. Theposition information of the stage 300 is constantly measured by a stageinterferometer 78 with respect to a mirror 77 fixed to the stage 300.The moving apparatus according to the embodiment of the presentinvention generates a control signal from a position signal output fromthe stage interferometer 78 and the like, and controls the position ofthe stage 300.

The exposure apparatus may perform scanning and exposure of transferringa predetermined region of the pattern of a master onto a substrate bymoving and scanning both the master and substrate with respect to anoptical system. In this case, the exposure apparatus can drive at leastone of the master and substrate during scanning by means of a stageprovided to the moving apparatus according to any preferred embodimentof the present invention. Ultraviolet rays may be used as the exposurelight. In this case, as the ultraviolet rays, for example, a laser beamfrom a fluorine excimer laser, an ArF excimer laser, or the like, whichuses a laser as the light source, is preferably used.

A semiconductor device manufacturing process utilizing the aboveexposure apparatus will be described. FIG. 8 is a flow chart of the flowof the overall semiconductor device manufacturing process. In step 1(circuit design), circuit design of a semiconductor device is performed.In step 2 (mask fabrication), a mask is fabricated based on the designedcircuit pattern. In step 3 (wafer fabrication), a wafer is manufacturedby using a material such as silicon. In step 4 (wafer process), called apre-process, an actual circuit is formed on the wafer by lithographyusing the prepared mask and wafer. In step 5 (assembly), called apost-process, a semiconductor chip is formed by using the waferfabricated in step 4, and includes processes such as an assembly process(dicing and bonding) and a packaging process (chip encapsulation). Instep 6 (inspection), inspections such as the operation confirmation testand durability test of the semiconductor device fabricated in step 5 areperformed. After these steps, the semiconductor device is completed, andshipped (step 7).

FIG. 9 is a flow chart showing the detailed flow of the wafer process.In step 11 (oxidation), the surface of the wafer is oxidized. In step 12(CVD), an insulating film is formed on the wafer surface. In step 13(electrode formation), an electrode is formed on the wafer by vapordeposition. In step 14 (ion implantation), ions are implanted in thewafer. In step 15 (resist processing), a photosensitive agent is appliedto the wafer. In step 16 (exposure), the circuit pattern is transferredto the wafer by using the above exposure apparatus. In step 17(development), the exposed wafer is developed. In step 18 (etching), theresist is etched except for the developed resist image. In step 19(resist removal), an unnecessary resist after etching is removed. Thesesteps are repeated to form multiple circuit patterns on the wafer.

According to the present invention, for example, positioning of a stagecan be controlled at high accuracy.

As many apparently widely different embodiments of the present inventioncan be made without departing from the spirit and scope thereof, it isto be understood that the invention is not limited to the specificembodiments thereof except as defined in the claims.

1. A moving apparatus comprising: a first actuator having a movableelement and a stator; a second actuator which drives said stator; a feedforward compensator which controls said second actuator on the basis ofa signal supplied to said first actuator or a physical quantity of saidmovable element; and a compensator which controls said second actuatoron the basis of an acceleration of said movable element, wherein saidsecond actuator drives said stator in a direction to suppress rotationof said stator which accompanies movement of said movable element. 2.The apparatus according to claim 1, wherein a target acceleration isused as the acceleration of said movable element.
 3. The apparatusaccording to claim 1, wherein an actual acceleration measured by ameasurement unit is used as the acceleration of said movable element. 4.The apparatus according to claim 1, wherein the signal includes amanipulated variable with which said first actuator is operated.
 5. Theapparatus according to claim 1, wherein a gain of said compensator isdetermined in accordance with a distance between a power point of saidmovable element in a predetermined direction and a barycenter of saidstator when said movable element is driven by said first actuator. 6.The apparatus according to claim 1, wherein said stator absorbs areaction force that acts on said stator when said movable element isdriven by said first actuator.
 7. A moving apparatus comprising: a firstactuator having a movable element and a stator; a second actuator whichdrives said stator; and a feed forward compensator which controls saidsecond actuator on the basis of a signal supplied to said first actuatoror a physical quantity of said movable element, wherein said secondactuator drives said stator in a direction to suppress rotation of saidstator which accompanies movement of said movable element, and wherein again of said compensator is determined in accordance with a distancebetween a power point of said movable element in a predetermineddirection and a barycenter of said stator when said movable element isdriven by said first actuator.
 8. The apparatus according to claim 7,further comprising a compensator which controls said second actuator onthe basis of an acceleration of said movable element.
 9. The apparatusaccording to claim 8, wherein a target acceleration is used as theacceleration of said movable element.
 10. The apparatus according toclaim 8, wherein an actual acceleration measured by a measurement unitis used as the acceleration of said movable element.
 11. The apparatusaccording to claim 7, wherein the signal includes a manipulated variablewith which said first actuator is operated.
 12. The apparatus accordingto claim 7, wherein said stator absorbs a reaction force that acts onsaid stator when said movable element is driven by said first actuator.